CUPROETCH BP is a process specifically formulated for etching copper seed layers on wafer substrates.

用于蚀刻晶圆衬底上的铜种子层优点：除了CUPROETCH BP工艺之外，浴化妆只需要去离子水典型性质外观：白色颗粒pH：<3.0（1％溶液）比重：1.045g /cm³可用性：亚太欧洲拉丁美洲北美

Used In:

Etching copper seed layers on wafer substrates

Advantages:

Bath make-up only requires deionized water in addition to the CUPROETCH BP process

Typical Properties

Appearance: White Granules

pH: <3.0 (1% Solution)

Specific Gravity: 1.045 g/cm³

Availability:

Asia Pacific

Europe

Latin America

North America