CUPROTEC™ BP process is designed to prevent the tarnishing of copper and copper-based alloys by atmospheric corrosion, improving the long-term shelf life and solderbility of exposed bare copper on wafer.

用于：防止铜和铜基合金的变色优点：改善晶圆上裸露的裸铜的长期保质期和可焊性CUPROTEC BP防护表面可利用RONACLEAN™BP系列产品中的一种轻易剥离其保护膜酸性清洁剂可通过浸渍或喷涂施工的多功能产品典型性质外观：透明，黄色液体pH值：6.5比重：1.06 g /cm³供货状态：北美洲

Used In:

Preventing the tarnishing of copper and copper-based alloys

Advantages:

Improves the long-term shelf life and solderbility of exposed bare copper on wafer CUPROTEC BP-protected surfaces

Can be readily stripped of their protective film, utilizing one of the RONACLEAN™ BP family of acid cleaners

Versatile product that can be applied by immersion or spray application

Typical Properties

Appearance: Clear, Yellow Liquid

pH: 6.5

Specific Gravity: 1.06 g/cm³

Availability:

North America