EVERON™ BP is a process designed to autocatalytically deposit semi-bright nickel-phosphorous alloys, containing 8-10% phosphorous, onto catalyzed copper and aluminum surfaces on silicon wafers.

用于：将半光亮镍磷合金自动催化沉积在硅晶片催化的铜和铝表面上优点：极长的溶液寿命平坦的沉积轮廓和始终如一的高沉积速度好的化学稳定性持久的沉积外观对金属污染的高耐受性铜和铝基材上的沉积物典型性能硬度：47 Rockwell熔点：890°C / 1,634°F电阻率：75 Microohm-Cm密度：7.9 g / cm3耐腐蚀性：约每小时200小时B 117适用规格：沉积符合Astm B 733，Mil-C 26074E和Ams 2404D规格。供货情况：亚太地区欧洲拉丁美洲北美洲

Used In:

Used in autocatalytically depositing semi-bright nickel-phosphorous alloys onto catalyzed copper and aluminum surfaces on silicon wafers

Advantages:

Extremely long solution life

Flat deposit profile and consistently

High deposition rate

Exceptional chemical stability

Consistent deposit appearance

High tolerance to metallic contamination

Deposits on copper and aluminum substrates

Typical Properties

Hardness: 47 Rockwell As Deposited

Melting Point: 890°C / 1,634°F

Electrical Resistivity: 75 Microohm-Cm

Density: 7.9 g/cm3

Corrosion Resistance: Approximately 200 Hours Per Astm B 117

Applicable Specifications: Deposits Meet Astm B 733, Mil-C 26074E And Ams 2404D Specifications.

Availability:

Asia Pacific

Europe

Latin America

North America