INTERVIA™3D-N REMOVER是一种水性有机酸性液体，用水稀释后用于去除INTERVIA™3D-N光敏剂，可用于浸泡，有或没有空气搅拌，也可用于压力喷雾操作。

INTERVIA™ 3D-N REMOVER is an aqueous, organic acid-based liquid that, when diluted with water, is used to remove INTERVIA™ 3D-N PHOTORESIST and can be used in immersion, with or without air agitation, or in a pressure spray operation.

用于：去除INTERVIA™3D-N PHOTORESIST优点：INTERVIA™3D-N PHOTORESIST的全水性去除剂可使铜表面明亮，不会对环氧树脂产生腐蚀或对孔壁粘附有不利影响易于控制和操作可用于浸泡，有或没有空气搅拌或压力喷雾应用典型特性比重：1.18-1.20（20°C）酸当量：10.5 - 11.0N（总量）供货情况：亚太欧洲拉丁美洲北美洲

Used In:

Removal of INTERVIA™ 3D-N PHOTORESIST

Advantages:

Fully aqueous remover for INTERVIA™ 3D-N PHOTORESIST leaves copper surface bright

Does not attack epoxy or have adverse effects on hole wall adhesion

Easy to control and operate

Can be used in immersion, with or without air agitation, or in a pressure spray application

Typical Properties

Specific Gravity: 1.18-1.20 (20° C)

Acid Normality: 10.5 - 11.0N (Total)

Availability:

Asia Pacific

Europe

Latin America

North America

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