RONASHED™ NT-10 is an electrolytic neutral process that releases mold "bleed" from plastic semiconductor packages without die attack problems.

用于：为了释放模具“流血”从塑料半导体封装，没有模具攻击问题优点：水性中性pH溶液不含卤素，不易燃电解质可以在电镀过程中或在专用电解假镀设备中运行防止染料侵蚀某些具有严重塑料闪光或树脂流失的基材从成型工艺的缺陷典型属性脚注：对于具体的产品数据值，请参阅产品装运分析证书。可用性：亚太地区

Used In:

For releasing mold "bleed" from plastic semiconductor packages without die attack problems

Advantages:

Aqueous-based neutral pH solution

Halide-free, non-flammable electrolyte

Can be run in-line with plating process or in dedicated electrolytic deflash equipment

Prevents dye attack for some substrates that have serious plastic flash or resin bleed resulting from defect of molding process

Typical Properties

Footnote: For The Specific Product Data Values, Please Refer To The Certificate Of Analysis Provided With The Shipment Of The Products.

Availability:

Asia Pacific